Packaging is essential for protecting and delivering our food safely but is often viewed as a wasteful and a problem for the environment. Although the industry has always examined and found solutions for packaging waste and improved sustainability, there are trends that drive change from decade to decade that provide new solutions. This presentation will focus on current drivers and trends for snack food packaging sustainability, circular economy and food waste reduction as well as possible solutions.
Dr. Kay Cooksey, Ph.D.
Professor and Cryovac Endowed Chair
Packaging Science Program
Department of Food, Nutrition and Packaging Sciences
Dr. Kay Cooksey is a Professor and is the Cryovac Endowed Chair in the Packaging Science Program at Clemson University. She joined the faculty at Clemson University in October 1998 after working at University of Wisconsin-Stout for 5 ½ years. Her B.S. degree is in Food Science from Purdue University, M.S. in Industrial Mechanical Technology with emphasis in Packaging, Ph.D. in Foods and Nutrition from University of Illinois. She was a Postdoctoral Associate at Purdue University and has interned at Dupont Packaging and Industrial Polymers Division. Her research focuses on food and packaging interactions and includes active and intelligent packaging (specifically antimicrobial and biosensors), shelf life, bio-based polymers and sustainable packaging.